mod-02 lec-09 wire bonding, tab and flipchip-1
Published 12 years ago • 30K plays • Length 57:11Download video MP4
Download video MP3
Similar videos
-
1:02:45
mod-02 lec-10 wire bonding, tab and flipchip-2; tutorials
-
19:51
würth elektronik webinar: chip-on-board - the small wire bonding 1 x 1
-
1:00
manual flip-chip bonding high accuracy 0.5µ by beckermus
-
1:00:53
mod-02 lec-08 wafer packaging; packaging evolution; chip connection choices
-
0:34
nordson asymtek: the nexjet system - flip chip underfill
-
1:39
s-king product: flip chip die bonder (high precision solution)
-
45:13
eevblog #341 - mailbag
-
14:58
introduction to flip chip technology
-
2:36
t-5300-w thermocompression bonding for flip chip
-
0:26
vertical flip chip bonding by pactech
-
0:46
i-cube soldering expansion module
-
0:08
chip packaging wire bonding
-
1:05
gbc tl2900 electric twin loop wire closer safety video
-
0:53
samtec ffsd/ffmd tiger eye™ flat idc ribbon cables | new product brief
-
1:23
bradygrip™ – the super-easy way to id wire and cable bundles | brady europe middle-east & africa
-
1:01
ad3552r 16-bit, 33 mups, multispan, multi-io spi dac
-
0:17
flip chip pick & place #1
-
26:08
lecture 11: flip chip technology
-
![[eng sub] flipchip die attach process: bump, mr(mass reflow), tcncp, lab(laser assist bond), ncp](https://i.ytimg.com/vi/Yr_1vcYdbvI/mqdefault.jpg)
5:27
[eng sub] flipchip die attach process: bump, mr(mass reflow), tcncp, lab(laser assist bond), ncp
-
0:46
dspic30f6014a-30i/pf general purpose 16-bit digital signal controller ic mcu 144kb flash 80tqfp
-
2:55
one-step soldering in flip-chip assembly