ocp 2020 tech week: die-to-die interface comparison: 2020 update
Published 3 years ago • 1K plays • Length 29:55Download video MP4
Download video MP3
Similar videos
-
45:46
ocp 2020 tech week: firmware updates & recovery
-
20:24
ocp 2020 tech week: ocp 2021 technical initiatives
-
21:33
ocp 2020 tech week: the bunch of wires interface 1.0 release
-
9:24
ocp 2020 tech week: hpc update
-
46:44
ocp 2020 tech week: panel: accelerator and device management
-
23:15
ocp 2020 tech week: nvme hdds
-
28:25
ocp 2020 tech week: odsa status update
-
1:01:14
ocp 2020 tech week: panel: d2d phys
-
30:43
ocp 2020 tech week: orv3 bbu shelf technical highlights
-
9:35
vertical stacked 48v 1v voltage regulator for ultra high current microprocessors
-
57:42
#109: direct-on-chip evaporative liquid cooling
-
20:41
ocp 2020 tech week: introduction to odsa openhbi high performance chip-to-chip interconnect
-
18:51
ocp 2020 tech week: ocp nic 3.0 specification update q4 2020
-
19:00
ocp 2020 tech week: demo: ocp nic 3.0 mechanical fit test fixture
-
18:56
ocp 2020 tech week: managing chiplet-based devices: requirements and challenges
-
1:47:17
ocp 2020 tech week: open discussion: building secure firmware
-
13:59
ocp 2020 tech week: lightning talk: odsa poc update
-
39:57
ocp 2020 tech week: a taller ocp nic – background, progress, & potential
-
15:16
ocp 2020 tech week: open discussion: acs
-
16:28
ocp 2020 tech week: offline head depopulation
-
13:38
ocp 2020 tech week: lightning talk: next generation oai high speed interconnect challenges
-
11:18
2020 ocp tech week china day: open edge standards and application (nokia)