joint ocp & jedec workshop - standards for chiplet design with 3dic packaging - day 1 (2024-06-14)
Published 11 days ago • 350 plays • Length 2:28:58Download video MP4
Download video MP3
Similar videos
-
18:52
using cdxml/jep30 models for chiplet design and verification
-
1:01:28
ocp 2020 tech week: panel: advanced packaging for chiplets integration
-
14:59
advanced packaging platforms and design kits for chiplets integration in hpc applications
-
10:01
ocp 2020 tech week: lightning talk: chiplet integration technologies
-
4:00:48
ocp odsa workshop - prototyping chiplet based open data accelerators
-
17:30
a chiplet based smartnic platform using bunch-of-wires
-
20:42
building an open chiplet economy
-
30:16
ocp 2020 tech week: an open chiplet link layer
-
14:46
why chiplet will transform the semiconductor ecosystem from design to packaging?
-
15:01
chiplet based reconfigurable ocp accelerator module (oam) architecture and platform
-
11:18
a chiplet reference platform utilizing ocp bunch-of-wires
-
1:39
s-king product: flip chip die bonder (high precision solution)
-
8:00
chiplet innovation ecosystem
-
19:08
chiplets for addressing challenges and use cases for ai and ml applications